Fabricating multifunction adhesive product for ubiquitous realtime tracking

ABSTRACT

A low-cost, multi-function tracking system with a form factor that unobtrusively integrates the components needed to implement a combination of different localization techniques and also is able to perform a useful ancillary function that otherwise would have to be performed with the attendant need for additional materials, labor, and expense. An example tracking system is implemented as an adhesive product that integrates tracking components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the components of the tracking system but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various tracking applications and workflows, including person and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/434,218, filed Dec. 14, 2016, and U.S. Provisional Application No.62/435,207, filed Dec. 16, 2016, both of which are incorporated hereinby reference.

BACKGROUND

Tracking devices can track people and objects in real time. Thesedevices typically ascertain information relating to their physicallocations based on communications with a variety of different wirelesslocationing systems (e.g., the Global Positioning System (GPS), cellularnetwork systems (e.g., GSM), and wireless local area networks (e.g., asystem of Wi-Fi access points). No single approach, however, providescontinuous tracking information under all circumstances. For example,the GPS tracking requires a tracking device to have an unobstructed viewof at least four GPS satellites at the same time, making GPS tracking inurban and indoor environments problematic. A variety of locationingtechniques have been developed for tracking in indoor environments,including vision-based localization, wireless based localization (e.g.,Received Signal Strength Indicator (RSSI) triangulation andfingerprinting techniques), and acoustic background fingerprinting. Eachof these techniques, however, requires certain infrastructure support(e.g., wireless access points at known locations) and/or prior knowledgeof the target environment (e.g., predetermined fingerprint maps) andtherefore is associated with its own set of problems and limitations.Dead reckoning locationing based on motion sensor measurements also maybe used, but the locationing accuracy of this approach is limited.

Tracking devices that incorporate multiple locationing mechanisms havebeen proposed to provide localization functionality across heterogeneousenvironments, ranging from environments equipped with localizationequipment (e.g., satellites, cellular towers, and wireless accesspoints), to environments without any localization equipment. However,incorporating a variety of different locationing components into atracking device poses significant integration difficulties andchallenges optimizing weight, size, cost, and battery life for a givenapplication. In addition, localization techniques used in areas withoutany infrastructure support are notoriously inaccurate and typicallyrequire a person to physically traverse a storage facility until theperson is close enough to the target to distinguish the signals (e.g.,RFID signals) emitted from multiple co-located tracking devices. Thus,there still remains a need to address the lack of sufficientinfrastructure to support continuous tracking across differentenvironments.

SUMMARY

This specification describes a low-cost, multi-function tracking systemwith a form factor that unobtrusively integrates the components neededto implement a combination of different localization techniques and alsois able to perform a useful ancillary function that otherwise would haveto be performed with the attendant need for additional materials, labor,and expense.

In an aspect, the tracking system is implemented as an adhesive productthat integrates tracking components within a flexible adhesive structurein a way that not only provides a cost-effective platform forinterconnecting, optimizing, and protecting the components of thetracking system but also maintains the flexibility needed to function asan adhesive product that can be deployed seamlessly and unobtrusivelyinto various tracking applications and workflows, including person andobject tracking applications, and asset management workflows such asmanufacturing, storage, shipping, delivery, and other logisticsassociated with moving products and other physical objects.

The adhesive product can have a variety of form factors, including amultilayer roll or sheet that includes a plurality of divisible adhesivesegments each of which is equipped with tracking functionality. Oncedeployed, each adhesive segment can function, for example, as anadhesive tape, label, sticker, decal, or the like and, at the same time,as an inconspicuous location tracker. In examples, each adhesive segmentcan track location information either autonomously or collectively withother activated segments. In an autonomous mode of operation, anadhesive segment can be configured to communicate with a variety ofdifferent wireless locationing systems and equipment to determine orassist in determining information relating to its geographic or relativelocation. In a collective mode of operation, a set of segments canadditionally communicate with one another to self-organize andself-configure into, for example, a mesh network and, thereby, createmechanisms or opportunities for acquiring and/or sharing acquiredlocation information in or across areas that are not supported byexisting infrastructure equipment.

Embodiments of the subject matter described in this specificationinclude methods, processes, systems, apparatus, and tangiblenon-transitory carrier media encoded with one or more programinstructions for carrying out one or more methods and processes forenabling tracking and fabrication functionalities of the describedsystems and apparatus.

In accordance with particular embodiments, a tracking adhesive productincludes a plurality of segments of a flexible laminated structurecomprising a flexible cover and a flexible substrate laminated to apressure sensitive adhesive layer. Each segment includes componentscomprising: a flexible antenna; a wireless communication system coupledto the flexible antenna; a processor coupled to the wirelesscommunications system; an energy source coupled to the processor and thewireless communication system; and at least one non-transitoryprocessor-readable medium comprising instructions which, when executedby the processor, configures the processor to perform operationscomprising controlling the wireless communication system to communicatewireless messages with one or more network nodes associated with alocationing service.

In particular embodiments, each of the plurality of segments includesthe flexible antenna, the wireless communication system, and theprocessor arranged in a device layer between the flexible cover and thesubstrate. In some examples, the energy source is arranged in the devicelayer; in other examples, the energy source is arranged between thedevice layer and the flexible substrate. In some examples, the energysource includes a cylindrical single cell battery arranged in the devicelayer between the flexible cover and the substrate. In some examples,the energy source includes a planar flexible battery arranged betweenthe device layer and the substrate.

Some embodiments include a flexible planarization layer between thedevice layer and the flexible cover, where the planarization layerplanarizes the device layer with a substantially planar surface facingthe flexible cover. In some examples, the flexible planarization layerincludes a flexible epoxy.

In particular embodiments, peripheral portions of the flexible cover andthe flexible substrate are bonded together.

Particular embodiments of the tracking adhesive product additionallyinclude peripheral sidewalls adhered to the flexible cover and theflexible substrate of the tracking adhesive product. In some examples,the peripheral sidewalls include extensions of one or both of theflexible cover and the flexible substrate.

In particular embodiments, one or more of the components are arranged ina first device layer and one or more other ones of the components arearranged in a second device layer. In some examples, an interposer isbetween the first and second device layers and includes one or morethrough-interposer vias electrically coupling one or more of thecomponents in the first device layer with one or more of the componentsin the second device layer.

In particular embodiments, the flexible substrate and the pressuresensitive adhesive layer are elements of a prefabricated adhesive tape.The flexible cover can be an element of a prefabricated adhesive tape.Each segment can additionally include one or more sensors selected froman altimeter, a gyrator, an accelerometer, a temperature sensor, and astrain sensor.

In particular embodiments, each of the plurality of segments isconfigured to automatically turn on in response to separation of therespective segment from the tracking adhesive product. In some examples,each of the plurality of segments comprises a respective wake circuitthat delivers power from the respective energy source to the respectiveprocessor and the respective wireless communications system in responseto an event. In some examples, the respective wake circuit deliverspower to the processor and the wireless communications system inresponse to a cut across the tracking adhesive product that creates anopen circuit in an electrical path of the respective wake circuit. Insome examples, a segment comprises a respective sensor, and therespective wake circuit delivers power to the respective processor andthe respective wireless communications system in response to an outputof the sensor. In some examples, a segment includes a strain sensor thatproduces a wake signal based on a change in strain in the respectivesegment. In some examples, a segment includes a capacitive sensor thatproduces a wake signal based on a change in capacitance in therespective segment. In some examples, a segment comprises a near fieldcommunications sensor that produces a wake signal based on a change ininductance in the respective segment.

In particular embodiments, the flexible cover comprises visibledemarcations of respective sections of the tracking adhesive productthat correspond to the segments. In some examples, the tracking adhesiveproduct is in the form of a roll comprising the plurality of segments.In some examples, the tracking adhesive product is in the form of aplanar sheet comprising the plurality of segments.

In particular embodiments, the different sections of the tapecommunicate thru a roll communication network.

In particular embodiments, a mobile phone is used to configure the tape(e.g., wake up conditions, tracking intervals) as well as associate tothe unique tape specific information such as a picture of the packagethat the user wants to track using the tracking adhesive product.

In particular embodiments, the frequency of measuring location can bedifferent than the frequency of communication the location information.

In particular embodiments, the communicate medium is also used forlocationing (vs. for example separate cellular connection and separateGPS).

In particular embodiments, the tape pro-actively sends a signal anddeals with upcoming battery shortage (e.g., thru shutting down or goingto a lower battery consumption mode).

Particular embodiments perform a method of fabricating a trackingadhesive product. In accordance with these embodiments a flexible tapesubstrate comprising a first adhesive layer is provided. At each ofrespective segment locations along the flexible tape substrate, one ormore device layers are formed, the one or more device layers comprisingone or more additional adhesive layers, an energy source, and arespective flexible circuit electrically connecting one or morecomponents configured to perform one or more location trackingfunctions. A flexible tape cover comprising a second adhesive layer isprovided. The one or more device layers between the flexible tapesubstrate and the flexible tape cover are annealed to form a flexiblecomposite tracking adhesive product structure.

In some examples of the fabrication method, the energy source includes aflexible battery, and the one or more components electrically connectedby the respective flexible circuit comprise a processor, a flexibleantenna, and a wireless communication circuit. The method furthercomprises, at locations on a flexible carrier tape corresponding therespective segment locations, fixing the processor, the flexibleantenna, and the wireless communication circuit on the respectiveflexible circuit to form a respective flexible circuit assembly. Eachrespective flexible circuit assembly is incorporated into one of the oneor more device layers at a respective segment location along theflexible tape substrate.

In some examples, the fabrication method further includes planarizingeach device layer with a flexible polymer adhesive.

Other features, aspects, objects, and advantages of the subject matterdescribed in this specification will become apparent from thedescription, the drawings, and the claims.

DESCRIPTION OF DRAWINGS

FIG. 1A is a diagrammatic view of a package that has been sealed forshipment using a segment of an example tracking adhesive productdispensed from a roll.

FIG. 1B is a diagrammatic top view of a portion of the segment of theexample tracking adhesive product shown in FIG. 1A.

FIG. 2 is a diagrammatic view of an example of an envelope carrying asegment of an example tracking adhesive product dispensed from a backingsheet.

FIG. 3 is a diagrammatic view of an example of a network environmentsupporting location tracking with segments of tracking adhesiveproducts.

FIG. 4 is a schematic view of an example tracking adhesive productsegment.

FIG. 5A is a diagrammatic top view of a length of an example trackingadhesive product.

FIG. 5B is a diagrammatic cross-sectional side view of a portion of thetracking adhesive product shown in FIG. 5A.

FIG. 6 is a flow diagram of an example process for fabricating atracking adhesive product.

FIG. 7A is a diagrammatic side view of tracking adhesive productfabrication system.

FIG. 7B is a diagrammatic side view of tracking adhesive productfabrication system.

FIG. 8A is a diagrammatic top view of a length of an example trackingadhesive product.

FIG. 8B is a diagrammatic cross-sectional side view of a first exampleimplementation of the tracking adhesive product shown in FIG. 8A.

FIG. 9 is a diagrammatic cross-sectional side view of a second exampleimplementation of the tracking adhesive product shown in FIG. 6.

FIG. 10 is a diagrammatic cross-sectional side view of a portion of anexample tracking adhesive product segment.

FIG. 11 is a diagrammatic top view of a length of an example trackingadhesive product.

FIG. 12A is a diagrammatic cross-sectional side view of a first exampleimplementation of the tracking adhesive product shown in FIG. 11.

FIG. 12B is a diagrammatic cross-sectional side view of a second exampleimplementation of the tracking adhesive product shown in FIG. 11.

FIG. 13A is a diagrammatic top view of a length of an example trackingadhesive product.

FIG. 13B is a diagrammatic top view of a length of an example trackingadhesive product.

FIG. 14 is diagrammatic cross-sectional side view of an example trackingadhesive product and an example package.

FIG. 15 is a block diagram of an example computer apparatus.

DETAILED DESCRIPTION

In the following description, like reference numbers are used toidentify like elements. Furthermore, the drawings are intended toillustrate major features of exemplary embodiments in a diagrammaticmanner. The drawings are not intended to depict every feature of actualembodiments nor relative dimensions of the depicted elements, and arenot drawn to scale.

In the instant specification, a tracking adhesive product is describedthat includes a plurality of segments that can be separated from theadhesive product (e.g., by cutting, tearing, peeling, or the like) andadhesively attached to a variety of different surfaces toinconspicuously implement any of a wide variety of different trackingapplications. Examples of such applications include inventory tracking,package tracking, person tracking, animal (e.g., pet) tracking,manufacturing parts tracking, and vehicle tracking. In exampleembodiments, each segment of an adhesive product is equipped with anenergy source, wireless communication functionality, and processingfunctionality that enable the segment to perform one or more locationingfunctions and report the locationing results to a remote server or othercomputer system. The tracking components of the system are encapsulatedwithin a flexible adhesive structure that protects the trackingcomponents from damage while maintaining the flexibility needed tofunction as an adhesive product (e.g., an adhesive tape or label) foruse in various tracking applications and workflows. In addition totracking functions, example embodiments also include one or more sensorsthat extend the utility of the platform by providing supplementalinformation regarding characteristics of the state and or environment ofa tracked article, object, vehicle, or person over time.

The instant specification also describes systems and processes forfabricating flexible multifunction adhesive products in efficient andlow-cost ways. In addition to using roll-to-roll and/or sheet-to-sheetmanufacturing techniques, the fabrication systems and processes areconfigured to optimize the placement and integration of trackingcomponents within the flexible adhesive structure to achieve highflexibility and ruggedness. In this way, these fabrication systems andprocesses are able to create a useful and reliable tracking adhesiveproducts that also can provide locationing and, in some examples,ambient sensing functionality. This functionality together with the lowcost of production is expected to encourage the ubiquitous deployment ofadhesive product segments and thereby alleviate at least some of theproblems arising from gaps in conventional locationing infrastructurecoverage that prevent continuous tracking across heterogeneousenvironments.

FIG. 1A shows an example package 10 that is sealed for shipment using anexample tracking adhesive product 12 that includes embedded trackingcomponents 14. In this example, a segment 13 of the tracking adhesiveproduct 12 is dispensed from a roll 16 and applied to the package 10.The tracking adhesive product 12 includes an adhesive side 18 and anon-adhesive side 20. The tracking adhesive product 12 can be dispensedfrom the roll 16 in the same way as any conventional packing tape,shipping tape, or duct tape. For example, the tracking adhesive product12 may be dispensed from the roll 16 by hand, laid across the seam wherethe two top flaps of the package 10 meet, and cut to a suitable lengtheither by hand or using a cutting instrument (e.g., scissors or anautomated or manual tape dispenser).

Referring to FIG. 1B, in some examples, the non-adhesive side 20 of thesegment 13 of the adhesive product 12 includes writing or other markingsthat may convey instructions, warnings, or other information to a personor machine (e.g., a bar code reader), or may simply be decorative and/orentertaining. In the illustrated example, the segment 13 of the trackingadhesive product 12 includes a two-dimensional bar code 22, writteninstructions 24 (i.e., “Cut Here”), and an associated cut line 26 thatindicates where the user should cut the tracking adhesive product 12.The written instructions 24 and the cut line 26 typically are printed orotherwise marked on the top, non-adhesive surface 20 of the trackingadhesive product 12 during manufacture. The two-dimensional bar code 22,on the other hand, may be marked on the non-adhesive surface 20 of thetracking adhesive product 12 during the manufacture of the adhesiveproduct 12 or, alternatively, may be marked on the non-adhesive surface20 of the tracking adhesive product 12 as needed using, for example, aprinter or other marking device.

In order to avoid damage to the tracking functionality of the segmentsof the tracking adhesive product 12, the cut lines 26 typicallydemarcate the boundaries between adjacent segments at locations that arefree of any tracking components 14. The spacing between the trackingcomponents 14 and the cut lines 26 may vary depending on the intendedtracking application or the intended adhesive application. In theexample illustrated in FIG. 1A, the length of the tracking adhesiveproduct 12 that is dispensed to seal the package 10 corresponds to asingle segment of the tracking adhesive product 12. In other examples,the length of tracking adhesive product 12 needed to seal a package orotherwise serve the adhesive function for which the tracking adhesiveproduct is being applied may include multiple segments 13 of thetracking adhesive product 12, one or more of which segments 13 may beactivated upon cutting the length of the tracking adhesive product 12from the roll 16 and/or applying the length of the tracking adhesiveproduct to the package 10.

In some examples, the tracking components 14 embedded in one or moresegments 13 of the tracking adhesive product 12 are activated when theadhesive product 12 is cut along the cut line 26. In these examples, thetracking adhesive product 12 includes one or more embedded energysources (e.g., thin film batteries or conventional cell batteries, suchas conventional watch style batteries) that supply power to the trackingcomponents 14 in one or more segments of the tracking adhesive product12 in response to being separated from the adhesive product 12 (e.g.,along a cut line 26).

In some examples, each segment 13 of the tracking adhesive product 12includes its own respective energy source. In some of these examples,each energy source is configured to only supply power to the componentsin its respective tracking adhesive product segment regardless of thenumber of contiguous segments 13 that are in a given length of trackingadhesive product 12. In other examples, when a given length of thetracking adhesive product 12 includes multiple segments 13, the energysources in the respective segments 13 are configured to supply power tothe tracking components 14 in all of the segments 13 in the given lengthof the tracking adhesive product 12. In some of these examples, theenergy sources are connected in parallel and concurrently activated topower the tracking components 14 in all of the segments 13 at the sametime. In other ones of these examples, the energy sources are connectedin parallel and alternately activated to power the tracking components14 in respective ones of the tracking adhesive product segments 13 atdifferent time periods, which may or may not overlap.

FIG. 2 shows an example tracking adhesive product 30 that includes a setof adhesive segments 32 each of which includes a respective set ofembedded tracking components 34, and a backing sheet 36 with a releasecoating that prevents the adhesive segments 34 from adhering strongly tothe backing sheet 36. Each segment 32 includes an adhesive side facingthe backing sheet 36, and an opposing non-adhesive side 40. In thisexample, a particular segment 32′ of the tracking adhesive product 30has been removed from the backing sheet 36 and affixed to an envelope44. Each segment 32 of the tracking adhesive product 30 can be removedfrom the backing sheet 36 in the same way that adhesive labels can beremoved from a conventional sheet of adhesive labels (e.g., by manuallypeeling a segment 32 from the backing sheet 36). In general, thenon-adhesive side 40′ of the segment 32′ may include any type ofwriting, markings, decorative designs, or other ornamentation. In theillustrated example, the non-adhesive side 40′ of the segment 32′includes writing or other markings that correspond to a destinationaddress for the envelope 44. The envelope 44 also includes a returnaddress 46 and, optionally, a postage stamp or mark 48.

In some examples, the tracking components 34 that are embedded in asegment 32 of the tracking adhesive product 12 are activated when thesegment 32 is removed from the backing sheet 32. In some of theseexamples, each segment 32 includes an embedded capacitive sensing systemthat can sense a change in capacitance when the segment 32 is removedfrom the backing sheet 36. As explained in detail below, a segment 32 ofthe adhesive product 30 includes one or more embedded energy sources(e.g., thin film batteries or common disk-shaped cell batteries) thatcan be configured to supply power to the tracking components 34 in thesegment 32 in response to the detection of a change in capacitancebetween the segment 32 and the backing sheet 36 as a result of removingthe segment 32 from the backing sheet 36.

FIG. 3 shows an example network environment 50 that includes a network52 that supports communications between a tracking service 54,localization equipment 56, and a client device 58. The network 52includes one or more network communication systems and technologies,including any one or more of wide area networks, local area networks,public networks (e.g., the internet), private networks (e.g., intranetsand extranets), wired networks, and wireless networks. The localizationequipment 56 includes any one or more of (i) satellite based trackingsystems 60 (e.g., GPS, GLONASS, and NAVSTAR) that transmit geolocationdata that can be received by suitably equipped receivers in segments ofa tracking adhesive product, (ii) cellular based systems that use mobilecommunication technologies (e.g., GSM, GPRS, CDMA, etc.) to implementone or more cell-based localization techniques, and (iii) localizationequipment 56, such as wireless access points (e.g., Wi-Fi nodes,Bluetooth nodes, ZigBee nodes, etc.) and other shorter rangelocalization technologies (e.g., ultrasonic localization and/or deadreckoning based on motion sensor measurements).

As explained in detail below, location data for one or more activatedtracking adhesive product segments 64 can be obtained using one or moreof the localization systems and technologies described above.

For example, a tracking adhesive product segment 64 that includes a GPSreceiver is operable to receive location data (e.g., geolocation data)from the Global Positioning System (GPS). In this process, the trackingadhesive product segment 64 periodically monitors signals from multipleGPS satellites. Each signal contains information about the time thesignal was transmitted and the position of the satellite at the time oftransmission. Based on the location and time information for each offour or more satellites, the GPS receiver determines the geolocation ofthe tracking adhesive product segment 64 and the offset of its internalclock from true time. Depending on its configuration, the trackingadhesive product segment 64 can either forward the received GPS locationdata to the tracking service 54 to determine its geolocation, or firstcompute geolocation coordinates from the received GPS location data andreport the computed geolocation coordinates to the tracking service 54.However, the tracking adhesive product segment 64 can only determine itsGPS location when it is able to receive signals from at least four GPSsatellites at the same time. As a result, GPS localization typically islimited or unavailable in urban environments and indoor locations.

Instead of or in addition to GPS localization, a tracking adhesiveproduct segment 64 can be configured to determine or assist indetermining its location using terrestrial locationing techniques. Forexample, Received Signal Strength Indicator (RSSI) techniques may beused to determine the location of a tracking adhesive product segment64. These techniques include, for example, fingerprint matching,trilateration, and triangulation. In an example RSSI fingerprintingprocess, one or more predetermined radio maps of a target area arecompared to geo-reference RSSI fingerprints that are obtained frommeasurements of at least three wireless signal sources (e.g., cellulartowers or wireless access points) in the target area to ascertain thelocation of the tracking adhesive product segment 64. The predeterminedradio maps typically are stored in a database that is accessible by thetracking service 54. In example RSSI triangulation and trilaterationprocesses, the location of a tracking adhesive product segment 64 can bedetermined from measurements of signals transmitted from at least threeomnidirectional wireless signal sources (e.g., cellular towers orwireless access points). Examples of the triangulation and trilaterationlocalization techniques may involve use of one or more of time ofarrival (TOA), angle of arrival (AOA), time difference of arrival(TDOA), and uplink-time difference of arrival (U-TDOA) techniques. RSSIfingerprint matching, trilateration, and triangulation techniques can beused with cellular and wireless access points that are configured tocommunicate with any of a variety of different communication standardsand protocols, including GSM, CDMA, Wi-Fi, Bluetooth, Bluetooth LowEnergy (BLE), LoRa, ZigBee, Z-wave, and RF.

In some examples, a tracking adhesive product segment 64 that includes aGSM/GPRS transceiver can scan GSM frequency bands for signalstransmitted from one or more GSM cellular towers. For each signalreceived by the tracking adhesive product segment 64, the trackingadhesive product segment 64 can determine the signal strength and theidentity of the cellular tower that transmitted the signal. The trackingadhesive product segment 64 can send the signal strength and transmitteridentifier to the tracking service 54 to determine the location of theadhesive product segment 64. If signal strength and transmitteridentifier is available from only one cellular tower, the trackingservice 54 can use nearest neighbor localization techniques to determinethe location of the tracking adhesive product segment 64. If signalstrength and transmitter identifier is received from two or morecellular towers, the tracking service 54 can use localizationtechniques, such as fingerprint matching, trilateration, andtriangulation, to calculate the position of the tracking adhesiveproduct segment 64.

In some examples, a tracking adhesive product segment 64 that includes aWi-Fi (Wireless-Fidelity) transceiver can scan Wi-Fi frequency bands forsignals transmitted from one or more Wi-Fi access points. For eachsignal received by the tracking adhesive product segment 64, thetracking adhesive product segment 64 can determine the signal strengthand the identity of the access point that transmitted the signal. Thetracking adhesive product segment 64 can send the signal strength andtransmitter identifier information to the tracking service 54 todetermine the location of the adhesive product segment 64. If signalstrength and transmitter identifier information is available from onlyone Wi-Fi access point, the tracking service 54 can use nearest neighborlocalization techniques to determine a location of the adhesive productsegment 64. If signal strength and transmitter identifier information isreceived from two or more Wi-Fi access points, the tracking service 54can use localization techniques, such as trilateration, andtriangulation, to calculate the position of an adhesive product segment64. RSSI fingerprint matching also can be used to determine the locationof the tracking adhesive product segment 64 in areas (e.g., indoor andoutdoor locations, such as malls, warehouses, airports, and shippingports) for which one or more radio maps have been generated.

In some examples, the wireless transceiver in the tracking adhesiveproduct segment 64 can transmit a wireless signal (e.g., a Wi-Fi,Bluetooth, Bluetooth Low Energy, LoRa, ZigBee, Z-wave, and/or RF signal)that includes the identifier of the tracking adhesive product segment64. The wireless signal can function as a beacon that can be detected bya mobile computing device (e.g., a mobile phone) that is suitablyconfigured to ascertain the location of the source of the beacon. Insome examples, a user (e.g., an operator affiliated with the trackingservice 54) may use the mobile computing device to transmit a signalinto an area (e.g., a warehouse) that includes the identifier of atarget tracking adhesive product segment 64 and configures the targettracking adhesive product segment 64 to begin emitting the wirelessbeacon signal. In some examples, the target tracking adhesive productsegment 64 will not begin emitting the wireless beacon signal until theuser/operator self-authenticates with the tracking service 54.

The tracking service 54 includes one or more computing resources (e.g.,server computers) that can be located in the same or differentgeographic locations. The tracking service 54 executes a locationingapplication 62 to determine the locations of activated tracking adhesiveproduct segments 64. In some examples, based on execution of thelocationing application 62, the tracking service 54 receives locationdata from one or more of the adhesive product segments 64. In someexamples, the tracking service 54 processes the data received fromtracking adhesive product segments 64 to determine the physicallocations of the tracking adhesive product segments 64. For example, theadhesive product segments 64 may be configured to obtain locationinginformation from signals received from a satellite system (e.g., GPS,GLONASS, and NAVSTAR), cell towers, or wireless access points, and sendthe locationing information to the tracking service 54 to ascertain thephysical locations of the tracking adhesive product segments 64. Inother examples, the tracking adhesive product segments 64 are configuredto ascertain their respective physical locations from the signalsreceived from a satellite system (e.g., GPS, GLONASS, and NAVSTAR), celltowers, or wireless access points, and to transmit their respectivephysical locations to the tracking service 54. In either or both cases,the tracking service 54 typically stores the locationing informationand/or the determined physical location for each tracking adhesiveproduct segment in association with the respective unique identifier ofthe tracking adhesive product segment. The stored data may be used bythe tracking service 54 to determine time, location, and state (e.g.,sensor based) information about the tracking adhesive product segments64 and the objects or persons to which the tracking adhesive productsegments 64 are attached. Examples of such information include trackingthe current location of a tracking adhesive product segment 64,determining the physical route traveled by the tracking adhesive productsegment 64 over time, and ascertaining stopover locations and durations.

As shown FIG. 3, the client device 58 includes a client application 66and a display 68. The client application 66 establishes sessions withthe tracking service 54 during which the client application obtainsinformation regarding the locations of the tracking adhesive productsegments 64. In some examples, a user of the client device 58 must beauthenticated before accessing the tracking service 54. In this process,the user typically presents multiple authentication factors to thesystem (e.g., user name and password). After the user is authenticated,the tracking service 54 transmits to the client device 58 dataassociated with the user's account, including information relating tothe tracking adhesive product segments 64 that are associated with theuser's account. The information may include, for example, the currentlocation of a particular tracking adhesive product segment 64, thephysical route traveled by the tracking adhesive product segment 64 overtime, stopover locations and durations, and state and/or changes instate information (as measured by one or more sensors associated withthe tracking adhesive product segment 64). The information may bepresented in a user interface on the display 68. Location and stateinformation may be presented in the user interface in any of a varietyof different ways, including in a table, chart, or map. In someexamples, the location and state data presented in the user interfaceare updated in real time.

FIG. 4 shows a block diagram of the components of a segment 70 of atracking adhesive product 64. The tracking adhesive product segment 70includes a number of communication systems 72, 74, an energy source 76,a processor 78, and, optionally, one or more sensors 80. Examplecommunication systems 72, 74 include a GPS system that includes a GPSreceiver circuit 82 (e.g., a receiver semiconductor circuit) and a GPSantenna 84, and one or more wireless communication systems each of whichincludes a respective transceiver circuit 86 (e.g., a transceiversemiconductor circuit) and a respective antenna 88. Example wirelesscommunication systems include a cellular communication system (e.g.,GSM/GPRS), a Wi-Fi communication system, an RF communication system(e.g., LoRa), a Bluetooth communication system (e.g., a Bluetooth LowEnergy system), a Z-wave communication system, and a ZigBeecommunication system. The tracking adhesive product segment 70 alsoincludes a processor 90 (e.g., a microcontroller or microprocessor), anenergy source 92 (e.g., a printed flexible battery or a conventionalsingle or multiple cell battery), and, optionally, one or more sensors94. Example sensors include a capacitive sensor, an altimeter, agyroscope, an accelerometer, a temperature sensor, a strain sensor, apressure sensor, a light sensor, and a humidity sensor. In someexamples, the tracking adhesive product segment 70 includes a memory 96for storing data (e.g., localization data and a unique identifier 98associated with the segment 70). In some examples, the memory 96 may beincorporated into one or more of the processor 90 or sensors 94, or maybe a separate component that is integrated in the tracking adhesiveproduct segment 70 as shown in FIG. 4.

Each segment 70 of the tracking adhesive product 64 integratescomponents of a tracking system with a flexible adhesive structure in away that not only provides a cost-effective platform forinterconnecting, optimizing, and protecting the components of thetracking system but also maintains the flexibility needed to function asa flexible adhesive product (e.g., a functional flexible tape or label)that can be deployed seamlessly and unobtrusively into various trackingapplications and workflows, including person and object trackingapplications, and asset management workflows such as manufacturing,storage, delivery, and other logistics associated with products andother physical objects. In addition, in order to encourage theubiquitous deployment of tracking adhesive product segments, thedisclosed tracking adhesive products are designed to be fabricated usingcost-effective fabrication methods, including roll-to-roll andsheet-to-sheet fabrication processes.

In this regard, the components of a tracking adhesive product 64 aredesigned and arranged to optimize performance, flexibility, androbustness for each target application. This encompasses factors, suchas material selection, component layout, and mechanical integrity of theintegrated system. To this end, electronic design automation tools areused to optimize the design across the constituent layers of a trackingadhesive product given prescribed performance targets (e.g., mechanicalintegrity targets, electrical performance targets, and/or wirelesscommunication performance targets). This includes simulations ofelectromagnetic wave behavior across layers, heat dissipation behavior,electrical parasitic behavior across layers (e.g., inductances,capacitances, and resistances), and mechanical behaviors (e.g., theimpact of bending and impressing bonding patterns on the trackingadhesive product 64). Based on these simulations, process technologydesign rules are developed for designing tracking adhesive products,including rules for integrating layers, rules for selecting the numberof layers, and rules for selecting the types of layers (e.g., throughinterposer vias, component layers, cover layers, substrate layers, andadhesive layers). In some examples, design rules are developed regardingthe layout of components in the different layers of a tracking adhesiveproduct 64. For example, minimum spacing and/or proximity rules aredeveloped for the placement of antennas, rigid components, flexiblecomponents, passive components, and active components. In theseexamples, rigid and active components, such as the communicationcircuits 82, 86 (e.g., receivers, transmitters, and transceivers) andthe processor 90, can have larger minimum spacing requirements thanflexible and passive components. In some examples, rigid components arespaced apart according to minimum spacing rules to satisfy mechanicalintegrity and flexibility performance targets. In some examples, activecomponents are laid out according to minimum spacing rules to satisfyheat dissipation performance targets. In some examples, design rules aredeveloped for hierarchical assembly of a tracking adhesive product byintegrating smaller tracking adhesive product components to form alarger integrated tracking adhesive product system.

FIG. 5A shows a top view of a portion of an example tracking adhesiveproduct 100 that includes a first segment 102 and a portion of a secondsegment 104. Each segment 102, 104 of the tracking adhesive product 100includes a respective set of tracking components 106, 108. The segments102, 104 and their respective sets of tracking components 106, 108typically are identical and configured in the same way. In some otherembodiments, however, the segments 102, 104 and/or their respective setsof tracking components 106, 108 may be different and/or configured indifferent ways. For example, in some examples, different sets of thesegments of the tracking adhesive product 100 may have different sets orconfigurations of tracking components that are designed and/or optimizedfor different tracking applications, or different sets of trackingadhesive product segments may have different ornamentations and/ordifferent (e.g., alternating) lengths.

FIG. 5B shows a cross-sectional side view of a portion of a segment 102of the tracking adhesive product 100 that includes tracking components106. The tracking adhesive product segment 102 includes a flexiblesubstrate 110 with an adhesive layer 112 on its top surface and anoptional adhesive layer 114 on its bottom surface. If the bottomadhesive layer 114 is present, a release liner (not shown) may be(weakly) adhered to the bottom surface of the adhesive layer 114. Insome examples, the flexible substrate 110 is implemented as aprefabricated adhesive tape that includes the adhesive layers 112, 114and the optional release liner. In other examples, the adhesive layers112, 114 are applied to the top and bottom surfaces of the flexiblesubstrate 110 during the fabrication of the tracking adhesive product100. The adhesive layer 112 bonds the flexible substrate 110 to a bottomsurface of a flexible battery 116, and an adhesive layer 118 bonds theflexible battery 116 to a flexible circuit 120 that includes one or morewiring layers (not shown) that connect the processor 90, the circuit 82,the antenna 84, and other components in a device layer 122 to each otherand to the flexible battery 116 and, thereby, enable the tracking andother functionalities of the tracking adhesive product segment 102. Insome examples, the adhesive layer 118 is implemented by a double-sidedadhesive tape. In other examples, the adhesive layer 118 is implementedby a flexible adhesive (e.g., silicone) that can planarize the topportion of the flexible battery layer. A flexible polymer layer 124encapsulates the device layer 122 and thereby reduces the risk of damagethat may result from the intrusion of contaminants and/or liquids (e.g.,water). The flexible polymer layer 124 also planarizes the device layer122. This facilitates stacking of additional layers on the device layer122 and also distributes forces generated in, on, or across the trackingadhesive product segment 102 so as to reduce potentially damagingasymmetric stresses that might be caused by the application of bending,torquing, pressing, or other forces on the tracking adhesive productsegment 102 during use. A flexible cover 128 is bonded to theplanarizing polymer 124 by an adhesive layer 128.

The flexible cover 126 and the flexible substrate 110 may have the sameor different compositions depending on the intended locationingapplication. The flexible cover 126 and the flexible substrate 110typically include flexible film layers and/or paper substrates. Examplecompositions for the flexible film layers include polymer films, such aspolyester, polyimide, polyethylene terephthalate (PET), and otherplastics. The adhesive layer 128 on the bottom surface of the flexiblecover 126 and the adhesive layers 112, 114 on the top and bottomsurfaces of the flexible substrate 110 typically include apressure-sensitive adhesive. In some examples, the adhesive layers 128,112, 110 are applied to the flexible cover 126 and the flexiblesubstrate 110 during manufacture of the tracking adhesive product 100(e.g., during a roll-to-roll or sheet-to-sheet fabrication process). Inother examples, the flexible cover 126 may be implemented by aprefabricated single-sided pressure-sensitive adhesive tape and theflexible substrate 110 may be implemented by a prefabricateddouble-sided pressure-sensitive adhesive tape; both kinds of tape may bereadily incorporated into a roll-to-roll or sheet-to-sheet fabricationprocess. In some examples, the flexible polymer layer 122 is composed ofa flexible epoxy (e.g., silicone).

In some examples, the flexible battery 116 includes a printedelectrochemical cell that includes a planar arrangement of an anode anda cathode and battery contact pads. In some examples, the flexiblebattery may include lithium-ion cells or nickel-cadmium electro-chemicalcells. The flexible battery 116 typically is formed by process thatincludes printing or laminating the electro-chemical cells on a flexiblesubstrate (e.g., a polymer film layer). In some examples, such as theexample shown in FIGS. 11A-11B, other components may be integrated onthe same substrate as the flexible battery 116. For example, one or moreof the flexible antennas 84, 88, the circuits 82, 86, 120, and/or theprocessor 90 may be integrated on the flexible battery substrate. Insome examples, one or more of these other components also (e.g., theflexible antennas and the flexible interconnect circuits) may be printedon the flexible battery substrate.

In some examples, the flexible circuit 120 is formed on a flexiblesubstrate by printing, etching, or laminating circuit patterns on theflexible substrate. In some examples, the flexible circuit 120 may beimplemented by one or more of a single-sided flex circuit, a doubleaccess or back bared flex circuit, a sculpted flex circuit, adouble-sided flex circuit, a multi-layer flex circuit, a rigid flexcircuit, and a polymer thick film flex circuit. A single-sided flexiblecircuit has a single conductor layer made of, for example, a metal orconductive (e.g., metal filled) polymer on a flexible dielectric film. Adouble access or back bared flexible circuit has a single conductorlayer but is processed so as to allow access to selected features of theconductor pattern from both sides. A sculpted flex circuit is formedusing a multi-step etching process that produces a flex circuit that hasfinished copper conductors that vary in thickness along their respectivelengths. A multilayer flex circuit has three of more layers ofconductors, where the layers typically are interconnected using platedthrough holes. Rigid flex circuits are a hybrid construction of flexcircuit consisting of rigid and flexible substrates that are laminatedtogether into a single structure, where the layers typically areelectrically interconnected via plated through holes. In polymer thickfilm (PTF) flex circuits, the circuit conductors are printed onto apolymer base film, where there may be a single conductor layer ormultiple conductor layers that are insulated from one another byrespective printed insulating layers.

In the example tracking adhesive product segments 102, 104 shown inFIGS. 5A-5B, the flexible circuit 120 is a double access flex circuitthat includes a front-side conductive pattern that interconnects thecommunication systems 72, 74, the processor 90, the one or more sensors94, and the memory 96, and allows through-hole access (not shown) to aback-side conductive pattern that is connected to the flexible battery116. In these examples, the front-side conductive pattern of theflexible circuit 120 connects the communications circuits 82, 86 (e.g.,receivers, transmitters, and transceivers) to their respective antennas84, 88 and to the processor 90, and also connects the processor 90 tothe one or more sensors 94 and the memory 96. The backside conductivepattern connects the active electronics (e.g., the processor 90, thecommunications circuits 82, 86, and the sensors) on the front-side ofthe flexible circuit 120 to the electrodes of the flexible battery 116via one or more through holes in the substrate of the flexible circuit120.

FIG. 6 shows an example method 130 of fabricating the adhesive product100 (see FIGS. 5A-5B) according to a roll-to-roll fabrication process.

In accordance with the method 130, a double-sided adhesive flexible tapesubstrate 110 is rolled out (FIG. 6, block 132). In this example, theflexible tape substrate 110 includes respective adhesive layers 112, 114on the top and bottom surfaces of the flexible tape substrate 110 (i.e.,the flexible tape substrate 110 incorporates layers 112 and 114). Insome examples, the flexible substrate 110 may be implemented by aprefabricated double-sided pressure-sensitive adhesive tape. In otherexamples, the adhesive layers 112, 114 are applied to the flexiblesubstrate 110 during manufacture of the adhesive product 100 (e.g., in aprocess step that precedes process block 132).

Flexible batteries 116 on a tape are rolled out and adhered to the topof the flexible tape substrate 110 by the adhesive layer 112 (FIG. 6,block 134). In some examples, each flexible battery 116 isprefabricated. In some of these examples, the flexible batteries 116 areprinted and/or laminated on a roll of flexible base tape. Each of theflexible batteries 116 includes one or more printed electrochemicalcells, an anode, and a cathode. During assembly of the tracking adhesiveproduct 100, individual flexible batteries 116 are separatedautomatically from the roll of flexible base tape and attached to thetop of the flexible tape substrate 110 at spaced apart locations. Insome examples, each flexible battery 116 is located in a respectivesegment 102, 104 of the tracking adhesive product 100.

A double-sided adhesive tape 118 is applied to the top surfaces of theflexible batteries (FIG. 6, block 136). In some other examples, insteadof applying the double-sided adhesive tape 118, an adhesiveplanarization layer can be deposited on the top of the flexiblebatteries. In some of these other examples, the adhesive planarizationlayer creates a planar surface for the device layer across the entiretyof each segment 102, 104 of the tracking adhesive product 100.

The components of the flexible circuit 120 are assembled and mounted onthe flexible circuit 120 (FIG. 6, block 138). In some examples, thisassembly occurs in a separate tape-based, roll-to-roll or sheet-to-sheetprocess in parallel with the main process flow. The resulting flexiblecircuit assembly is attached to the adhesive planarization layer 118(FIG. 6, block 140). In this way, the fabrication process involves ahierarchical assembly approach in which one or more smaller tape-basedmodules (i.e., Systems-on-Tape), such as the flexible circuit assembliescreated in block 138, are created and subsequently integrated into alarger System-on-Tape.

As explained above, in some examples, the flexible circuit 120 is adouble access flex circuit that includes a front-side conductive patternthat interconnects the communication systems 72, 74, the processor 90,the one or more sensors 94, and the memory 96, and allows through-holeaccess to a back-side conductive pattern that is mechanically andelectrically connected to the flexible battery 116. In these examples,the front-side conductive pattern of the flexible circuit 120 connectsthe communications circuits 82, 86 to their respective antennas 84, 88and to the processor 90, and also connects the processor 90 to the oneor more sensors 94 and the memory 96. The active electronics (e.g., theprocessor 90, the communications circuits 82, 86, and the sensors) onthe front-side of the flexible circuit 120 are electrically connected toa backside conductive pattern of the flexible circuit 120 by means ofone or more through-hole vias in the substrate of the flexible circuit120. The backside conductive pattern defines contact pads that aremechanically and electrically coupled to the electrodes of the flexiblebattery 116 in order to power the active electronics on the front-sideof the flexible circuit 120. In some examples, the contact pads arebonded to the flexible battery electrodes using electrically conductiveink or an electrically conductive adhesive. In other examples, theflexible battery 116 is printed on the front-side of the flexiblecircuit 120, in which case a single-sided flex circuit may be usedinstead of the double access flex circuit.

A flexible polymer planarization layer 124 is deposited on top of theflexible circuit assembly (FIG. 6, block 142). In some examples, theflexible polymer is a flexible epoxy (e.g., silicone). The flexiblepolymer layer 124 encapsulates the device layer 122 and thereby reducesthe risk of damage that may result from the intrusion of contaminantsand/or liquids (e.g., water). The flexible polymer layer 124 alsoplanarizes the device layer 122. In some examples, the flexible polymerlayer 124 planarizes the entirety of each segment 102, 104 of theadhesive product 100.

A single-sided flexible tape cover 126 is rolled out and adhered to thetop of the epoxy planarization layer 124 (FIG. 6, block 144). In thisexample, the flexible tape cover 126 includes a pressure-sensitiveadhesive layer on the backside of the flexible tape cover 126 (i.e., theflexible tape cover 126 incorporates layer 128). In some examples, theflexible tape cover 126 may be implemented by a prefabricatedsingle-sided pressure-sensitive adhesive tape. In other examples, theadhesive layer 128 is applied to the flexible tape cover 126 duringmanufacture of the adhesive product 100 (e.g., in a process step thatprecedes process block 144).

After the flexible tape cover has been adhered to the top of the epoxyplanarization layer 124, the resulting multilayer tracking adhesiveproduct structure is laminated (FIG. 6, block 146). In some examples,the multilayer tracking adhesive product structure is annealed at asuitable annealing temperature (e.g., 120° C.). A variety of differentannealing equipment may be used to anneal the multilayer trackingadhesive product structure. In some examples, the multilayer trackingadhesive product structure is annealed in a laminator.

Referring to FIG. 7A, in one example, a laminator 150 is used to annealand laminate the component elements of the tracking adhesive product100. In this example, the laminating rolls 152 of the laminator 150 canapply a programmed heating intensity profile over time that is designedto avoid or at least minimize degradation of heat sensitive componentsof the tracking adhesive product 100, such as the flexible battery 116.

Referring to FIG. 7B, in another example, a laminator 160 that includesan anvil 162 and an embossing roller 164 is used to anneal and laminatethe multilayer tracking adhesive product structure with bonding patternsthat are designed control one or more different specific properties ofthe tracking adhesive product. For example, the combination and pressureand an embossing pattern that is selected to increase the adhesionbetween the constituent layers of the adhesive tracking product 100. Thebonding patterns also can be designed to increase adhesive between thelayers while preserving the functionality and performance of theelectronic and other components of the adhesive tracking product 100,such as the flexible battery 116 and the antennas 84, 88. For example,the constituent layers of the adhesive tracking product 100 can beembossed with an embossing pattern with a spatial frequency that isselected to minimize any deformation or other change in the structure orproperties of one or more of the antennas that would result in degradingone or more performance characteristics of the antennas (e.g., gain,radiation pattern, efficiency, and impedance match).

FIGS. 8A and 8B respectively show a top view and a cross-sectional sideview (along the line 8B-8B in FIG. 8A) of a portion of an exampletracking adhesive product 170 that includes first and second segments172, 174 each of which includes a respective set of tracking components176, 178. The structure and operation of tracking adhesive product 170and its constituent components substantially corresponds to the trackingadhesive product 100 and its constituent components (see FIGS. 5A and5B) except that the tracking adhesive product 170 additionally includeslateral ruggedization features 180, 182 that extend along the sides ofthe tracking adhesive product 170. In particular, each lateralruggedization feature 180, 182 wraps around a respective longitudinalside of the tracking adhesive product 170, from the bottom adhesivelayer 114 to the top surface of the cover 126. The lateral ruggedizationfeatures 180, 182 are rectangular sheets of tape that typically areformed of a polymer film, such as, polyester, polyimide, polyethyleneterephthalate (PET), and/or other plastic material). In some examples,the lateral ruggedization features 180, 182 are bonded to the trackingadhesive product 170 using an adhesive, such as a pressure-sensitiveadhesive or other adhesive such as a flexible epoxy (e.g., silicone).The lateral ruggedization features 180, 182 improve the ruggedness ofthe tracking adhesive product 170 by bonding a common flexible sheet tothe exposed edges of the constituent layers on each side of the trackingadhesive product 170. In this way, the lateral ruggedization features180, 182 provide additional structural support for holding the sheetstogether and reducing opportunities for the sides of the constituentlayers of the tracking adhesive product 170 to fray and/or delaminate.

FIG. 9 shows a cross-sectional side view of an alternative example of atracking adhesive product 184 with lateral ruggedization features. Inthis example, the lateral ruggedization features 180, 182 of thepreceding example tracking adhesive product 170 are implemented bylateral extensions of an example flexible substrate 186. In thisexample, the lateral sides of the flexible substrate 186 extend outlaterally and wrap around the lateral sides of the tracking adhesiveproduct 184. In some examples, the lateral extensions of the flexiblesubstrate 186 are bonded to the tracking adhesive product 170 using anadhesive, such as a pressure-sensitive adhesive or other adhesive suchas a flexible epoxy (e.g., silicone).

FIG. 10 shows a cross-sectional side view of an example of a trackingadhesive product 190 that includes a stacked arrangement of first andsecond interconnected device layers 192, 194. In this example, thestacked arrangement of device layers 192, 194 enables the trackingadhesive product 190 to have a tightly integrated structure thatoccupies a relatively small areal footprint in the tape structure and apotentially optimal layout of active components (e.g., processor 90,wireless circuits 200, 202, and sensors 203).

The first device layer 192 includes a flexible circuit 196 and aplanarization layer 198, which may be a flexible epoxy (e.g., silicone).The flexible circuit 196 includes one or more wiring layers thatinterconnect the processor 90 and the wireless circuits 200, 202 to eachother and to the flexible battery 116. In some examples, the wirelesscircuit 200 is a GPS receiver, and the wireless circuit 202 is a Wi-Fitransceiver 202.

The second device layer 194 includes a flexible interposer 204 and aplanarization layer 206, which may be a flexible epoxy (e.g., silicone).The flexible interposer 204 includes one or more wiring layers (notshown) that connect the sensor(s) 203 to contact pads 214 on theflexible interposer 204. The contact pads 214 are connected to theelectrodes of the flexible battery 116 by means of a pair of connectedvias 216, 218 (i.e., “Through-Tape-Vias”) that respectively extendthrough the flexible interposer 204, the planarization layer 198, andthe flexible circuit 196. In addition, the antennas 208, 210 areconnected to the respective wireless circuits 200, 202 by means ofrespective Through-Tape-Vias 220, 222.

In the example tracking adhesive product 190, placing the antennas 208,210 and the sensors 203 in the top device layer 194 may improve theperformance of these devices. For example, positioning the antennas 208,210 in the top device layer 194 may improve one or more transmissionand/or reception performance characteristics of the antennas 208, 210(e.g., gain, radiation pattern, efficiency, and impedance match).Positioning the sensors 203 in the top device layer 194 also may improvetheir performance. For example, depending on the sensor type, one ormore of the sensors 203 may require direct access or exposure to theexterior environment. Examples of these types of sensors includetemperature sensors, ambient humidity sensors, ambient pressure sensors,ambient light sensors, and sound sensors. For these types of sensors,one or more openings or windows can be created in the flexible cover 126and optionally through the pressure-sensitive adhesive layer 128 and theplanarization layer 206.

In the examples shown in FIGS. 5A and 5B, the tracking components 106,108 in each segment 102, 104 are grouped in a central portion of theirrespective segment 102, 104. Such a layout may be advantageous forachieving certain performance targets, such as improved electricalperformance (e.g., lower parasitic resistance, capacitance, andinductance) as a result of placing components closer together. However,such improvement may conflict with other design objectives andconsiderations, such as improved flexibility, which can be achieved bydistributing the tracking components 106, 108 in each segment 102, 104with larger minimum spacing requirements longitudinally along the lengthand/or laterally along the width of each segment 102, 104 and/oravoiding a staggered placement of rigid components in different layersacross the lateral and/or longitudinal dimensions of the trackingadhesive product segments 102, 104 that otherwise would reduce theflexibility of the tracking adhesive product. In addition, at least forsome applications, there may be a need to reduce the number of stackedflexible substrates in the tracking adhesive product to meetflexibility, heat dissipation, or other performance targets. Therefore,in some examples, the tracking components, the sensor components, theenergy source, and other components of the tracking adhesive product canbe incorporated into a single device layer.

FIG. 11 shows a top view of a portion of an example tracking adhesiveproduct 230 that includes a first segment 232 and a portion of a secondsegment 234. Each segment 232, 234 of the tracking adhesive product 230includes a respective set of tracking components 236, 238 and optionallymay include a respective set of one or more sensor components. In theexample tracking adhesive product 230, the tracking components 236, 238(and optional sensor components) are distributed laterally and/orlongitudinally over a larger area of the tracking adhesive product 230in order to satisfy larger minimum spacing requirements and flexibilityrequirements. In addition, instead of stacking the tracking components236 of a given segment in multiple layers, the tracking components 236,238 (and optional sensor components) are laid out in a single devicelayer.

FIG. 12A shows a cross-sectional side view of a portion of a segment 232of the tracking adhesive product 231 that includes tracking components236. The tracking adhesive product segment 232 includes a flexiblesubstrate 110 with an adhesive layer 112 on its top surface and anoptional adhesive layer 114 on its bottom surface. If the bottomadhesive layer 114 is present, a release liner (not shown) may be(weakly) adhered to the bottom surface of the adhesive layer 114. Theadhesive layer 112 bonds the flexible substrate 110 to a bottom surfaceof a flexible circuit 242 that includes one or more wiring layers (notshown) that connect a processor, a circuit (e.g., a wireless receivercircuit, wireless transmitter circuit, or wireless transceiver circuit),an antenna, and other components (e.g., one or more sensors) in thedevice layer to each other and to the flexible battery 240 and, thereby,enable the tracking and other functionalities of the tracking adhesiveproduct segment 231. A flexible polymer layer 244 encapsulates thedevice layer and thereby reduces the risk of damage that may result fromthe intrusion of contaminants and/or liquids (e.g., water). The flexiblepolymer layer 244 also planarizes the device, which distributes forcesgenerated in, on or across the tracking adhesive product segment 232 soas to reduce potentially damaging asymmetric stresses that might becaused by the application of bending, torquing, pressing, or otherforces on the tracking adhesive product segment 231. A flexible cover246 is bonded to the planarizing polymer 244 by an adhesive layer 248.

FIG. 12B shows a cross-sectional side view of an alternative example 250of the segment 232 of the tracking adhesive product 231 shown in FIG.12A. The only difference between this alternative example 250 and theexample 232 shown in FIG. 12A is that the flexible battery 240 in theexample 232 has been replaced by a conventional single or multiple cellbattery 252 (e.g., a watch style disk or button cell battery) andassociated electrical connection apparatus 254 (e.g., a metal clip) thatelectrically connects the electrodes of the battery 252 to contact padson the flexible circuit 242.

Because battery power is finite and the power needs of any particulartracking adhesive product segment generally is unknown, some examples ofthe tracking adhesive product segments are preconfigured in a power-offstate and to remain in the power-off state until a predetermined eventoccurs. In some cases, the predetermined event indicates that theadhesive product segment has been deployed for use in the field. Exampleevents include cutting a segment of a tracking adhesive product from aroll, bending a segment of a tracking adhesive product as it is beingpeeled off of a roll, separating a segment of a tracking adhesiveproduct from a sheet, and detecting a change in state of the trackingadhesive product.

Referring to FIG. 13A, in some examples, each of one or more of thesegments 270, 272 of a tracking adhesive product 274 includes arespective circuit 275 that delivers power from the respective energysource 276 to the respective tracking circuit 278 (e.g., a processor andone or more wireless communications circuits) in response to an event.In some of these examples, the wake circuit 275 is configured totransition from an off state to an on state when the voltage on the wakenode 277 exceeds a threshold level, at which point the wake circuittransitions to an on state to power-on the segment 270. In theillustrated example, this occurs when the user separates the segmentfrom the tracking adhesive product 274, for example, by cutting acrossthe tracking adhesive product 274 at a designated location (e.g., alonga designated cut-line 280). In particular, in its initial, un-cut state,a minimal amount of current flows through the resistors R₁ and R₂. As aresult, the voltage on the wake node 270 remains below the thresholdturn-on level. After the user cuts across the tracking adhesive product274 along the designated cut-line 280, the user creates an open circuitin the loop 282, which pulls the voltage of the wake node above thethreshold level and turns on the wake circuit 275. As a result, thevoltage across the energy source 276 will appear across the trackingcircuit 278 and, thereby, turn on the segment 270. In particularembodiments, the resistance vale of resistor R₁ is greater than theresistance value of R₂. In some examples, the resistance values ofresistors R₁ and R₂ are selected based on the overall design of theadhesive product system (e.g., the target wake voltage level and atarget leakage current).

In some examples, each of one or more of the segments of a trackingadhesive product includes a respective sensor and a respective wakecircuit that delivers power from the respective energy source to therespective one or more of the respective tracking components 278 inresponse to an output of the sensor. In some examples, the respectivesensor is a strain sensor that produces a wake signal based on a changein strain in the respective segment. In some of these examples, thestrain sensor is affixed to a tracking adhesive product and configuredto detect the stretching of the tracking adhesive product segment as thesegment is being peeled off a roll or a sheet of the tracking adhesiveproduct. In some examples, the respective sensor is a capacitive sensorthat produces a wake signal based on a change in capacitance in therespective segment. In some of these examples, the capacitive sensor isaffixed to a tracking adhesive product and configured to detect theseparation of the tracking adhesive product segment from a roll or asheet of the tracking adhesive product. In some examples, the respectivesensor is a flex sensor that produces a wake signal based on a change incurvature in the respective segment. In some of these examples, the flexsensor is affixed to a tracking adhesive product and configured todetect bending of the tracking adhesive product segment as the segmentis being peeled off a roll or a sheet of the tracking adhesive product.In some examples, the respective sensor is a near field communicationssensor that produces a wake signal based on a change in inductance inthe respective segment.

FIG. 13B shows another example of a tracking adhesive product 294 thatdelivers power from the respective energy source 276 to the respectivetracking circuit 278 (e.g., a processor and one or more wirelesscommunications circuits) in response to an event. This example issimilar in structure and operation as the tracking adhesive product 294shown in FIG. 13A, except that the wake circuit 275 is replaced by aswitch 296 that is configured to transition from an open state to aclosed state when the voltage on the switch node 277 exceeds a thresholdlevel. In the initial state of the tracking adhesive product 294, thevoltage on the switch node is below the threshold level as a result ofthe low current level flowing through the resistors R₁ and R₂. After theuser cuts across the tracking adhesive product 294 along the designatedcut-line 280, the user creates an open circuit in the loop 282, whichpulls up the voltage on the switch node above the threshold level toclose the switch 296 and turn on the tracking circuit 278.

FIG. 14 shows a diagrammatic cross-sectional front view of an exampletracking adhesive product 300 and a perspective view of an examplepackage 302. Instead of activating the tracking adhesive product inresponse to separating a segment of the tracking adhesive product from aroll or a sheet of the tracking adhesive product, this example isconfigured to supply power from the energy source 302 to turn on thetracking circuit 306 in response to establishing an electricalconnection between two power terminals 308, 310 that are integrated intothe tracking adhesive product. In particular, each segment of thetracking adhesive product 300 includes a respective set of embeddedtracking components, an adhesive layer 312, and an optional backingsheet 314 with a release coating that prevents the segments fromadhering strongly to the backing sheet 314. In some examples, the powerterminals 308, 310 are composed of an electrically conductive material(e.g., a metal, such as copper) that may be printed or otherwisepatterned and/or deposited on the backside of the tracking adhesiveproduct 300. In operation, the tracking adhesive product can beactivated by removing the backing sheet 314 and applying the exposedadhesive layer 312 to a surface that includes an electrically conductiveregion 316. In the illustrated embodiment, the electrically conductiveregion 316 is disposed on a portion of the package 302. When theadhesive backside of the tracking adhesive product 300 is adhered to thepackage with the exposed terminals 308, 310 aligned and in contact withthe electrically conductive region 316 on the package 302, an electricalconnection is created through the electrically conductive region 316between the exposed terminals 308, 310 that completes the circuit andturns on the tracking circuit 306. In particular embodiments, the powerterminals 308, 310 are electrically connected to any respective nodes ofthe tracking circuit 306 that would result in the activation of thetracking circuit 306 in response to the creation of an electricalconnection between the power terminals 308, 310.

In some examples, after an adhesive product segment is turned on, itwill communicate with the tracking service 54 to confirm that theuser/operator who is associated with the adhesive product segment is anauthorized user who has authenticated himself or herself to the trackingservice 54. In these examples, if the adhesive product segment cannotconfirm that the user/operator is an authorized user, the adhesiveproduct segment will turn itself off.

FIG. 15 shows an example embodiment of computer apparatus that, eitheralone or in combination with one or more other computing apparatus, isoperable to implement one or more of the computer systems described inthis specification, including one or more of the tracking service system54, the network system 52, the client system 58, and the localizationequipment 56.

The computer apparatus 320 includes a processing unit 322, a systemmemory 324, and a system bus 326 that couples the processing unit 322 tothe various components of the computer apparatus 320. The processingunit 322 may include one or more data processors, each of which may bein the form of any one of various commercially available computerprocessors. The system memory 324 includes one or more computer-readablemedia that typically are associated with a software applicationaddressing space that defines the addresses that are available tosoftware applications. The system memory 324 may include a read onlymemory (ROM) that stores a basic input/output system (BIOS) thatcontains start-up routines for the computer apparatus 320, and a randomaccess memory (RAM). The system bus 326 may be a memory bus, aperipheral bus or a local bus, and may be compatible with any of avariety of bus protocols, including PCI, VESA, Microchannel, ISA, andEISA. The computer apparatus 320 also includes a persistent storagememory 328 (e.g., a hard drive, a floppy drive, a CD ROM drive, magnetictape drives, flash memory devices, and digital video disks) that isconnected to the system bus 326 and contains one or morecomputer-readable media disks that provide non-volatile or persistentstorage for data, data structures and computer-executable instructions.

A user may interact (e.g., input commands or data) with the computerapparatus 320 using one or more input devices 330 (e.g. one or morekeyboards, computer mice, microphones, cameras, joysticks, physicalmotion sensors, and touch pads). Information may be presented through agraphical user interface (GUI) that is presented to the user on adisplay monitor 332, which is controlled by a display controller 334.The computer apparatus 320 also may include other input/output hardware(e.g., peripheral output devices, such as speakers and a printer). Thecomputer apparatus 320 connects to other network nodes through a networkadapter 336 (also referred to as a “network interface card” or NIC).

A number of program modules may be stored in the system memory 324,including application programming interfaces 338 (APIs), an operatingsystem (OS) 340 (e.g., the Windows® operating system available fromMicrosoft Corporation of Redmond, Wash. U.S.A.), software applications341 including one or more software applications programming the computerapparatus 320 to perform one or more of the steps, tasks, operations, orprocesses of the locationing and/or tracking systems described herein,drivers 342 (e.g., a GUI driver), network transport protocols 344, anddata 346 (e.g., input data, output data, program data, a registry, andconfiguration settings).

Examples of the subject matter described herein, including the disclosedsystems, methods, processes, functional operations, and logic flows, canbe implemented in data processing apparatus (e.g., computer hardware anddigital electronic circuitry) operable to perform functions by operatingon input and generating output. Examples of the subject matter describedherein also can be tangibly embodied in software or firmware, as one ormore sets of computer instructions encoded on one or more tangiblenon-transitory carrier media (e.g., a machine readable storage device,substrate, or sequential access memory device) for execution by dataprocessing apparatus.

The details of specific implementations described herein may be specificto particular embodiments of particular inventions and should not beconstrued as limitations on the scope of any claimed invention. Forexample, features that are described in connection with separateembodiments may also be incorporated into a single embodiment, andfeatures that are described in connection with a single embodiment mayalso be implemented in multiple separate embodiments. In addition, thedisclosure of steps, tasks, operations, or processes being performed ina particular order does not necessarily require that those steps, tasks,operations, or processes be performed in the particular order; instead,in some cases, one or more of the disclosed steps, tasks, operations,and processes may be performed in a different order or in accordancewith a multi-tasking schedule or in parallel.

Other embodiments are within the scope of the claims.

The invention claimed is:
 1. A method of fabricating an adhesiveproduct, comprising: providing a flexible tape substrate; at each ofmultiple respective segment locations along the flexible tape substrate,forming at least one device layer comprising an antenna, a wirelesscommunications system, a sensor operable to generate ambient datacharacterizing an environmental state of the segment in response toexposure to external stimulus, a processor, an energy source, at leastone non-transitory processor-readable medium, and at least onerespective flexible circuit electrically connecting the wirelesscommunications system to the antenna, the processor to the wirelesscommunications system and the sensor, and the energy source to theprocessor, the sensor, and the wireless communications system; providinga flexible tape cover; and annealing the at least one device layerbetween the flexible tape substrate and the flexible tape cover to forma flexible laminated structure; and encoding the at least onenon-transitory processor-readable medium with processor-readableinstructions which, when executed by the processor, configures theprocessor to perform operations comprising processing the ambient data,storing the processed ambient data, and controlling the wirelesscommunications system to transmit wireless messages comprising theprocessed ambient data to one or more network nodes.
 2. The method ofclaim 1, wherein, in each of multiple ones of the segments, therespective energy source comprises a flexible battery.
 3. The method ofclaim 1, wherein, in each of multiple ones of the segments, therespective energy source comprises a cylindrical single cell batteryarranged in the device layer between the flexible tape cover and theflexible tape substrate.
 4. The method of claim 1, further comprisingplanarizing the at least one device layer with a flexible polymer. 5.The method of claim 4, wherein the flexible polymer layer planarizes thedevice layer with a substantially planar surface facing the flexiblecover.
 6. The method of claim 5, wherein the flexible polymer layercomprises a flexible epoxy.
 7. The method of claim 4, wherein theplanarizing comprises encapsulating the device layer with the flexiblepolymer layer.
 8. The method of claim 1, further comprising bondingperipheral portions of the flexible tape substrate to correspondingperipheral portions of the flexible tape cover.
 9. The method of claim1, further comprising, at each of multiple segment locations, providinga respective opening in the flexible laminated structure that exposesthe sensor to external ambient conditions.
 10. The method of claim 1,wherein the sensor is a GPS sensor.
 11. The method of claim 1, whereinthe sensor is one of a capacitive sensor, a pressure sensor, a humiditysensor, a light sensor, a sound sensor, an altimeter, a gyrator, anaccelerometer, a temperature sensor, a flex sensor, and a strain sensor.12. The method of claim 1, wherein each of multiple ones of the segmentscomprises a respective wake circuit that delivers power from therespective energy source to the respective processor and the respectivewireless communications system in response to a separation of therespective segment from the adhesive product that comprises a cut acrossthe adhesive product that creates an open circuit in an electrical pathof the respective wake circuit.
 13. The method of claim 12, furthercomprising producing visible demarcations of cut lines between adjacentsections of the adhesive product.
 14. A method of fabricating anadhesive product, comprising: providing a flexible tape substrate; ateach of multiple respective segment locations along the flexible tapesubstrate, forming at least one device layer comprising an antenna, awireless communications system, a processor, an energy source, arespective wake circuit that delivers power from the respective energysource to the respective processor and the respective wirelesscommunications system in response to a separation of the respectivesegment from the adhesive product that comprises a cut across theadhesive product that creates an open circuit in an electrical path ofthe respective wake circuit, at least one non-transitoryprocessor-readable medium, and at least one respective flexible circuitelectrically connecting the wireless communications system to theantenna, the processor to the wireless communications system, and theenergy source to the processor, and the wireless communications system;providing a flexible tape cover; annealing the at least one device layerbetween the flexible tape substrate and the flexible tape cover to forma flexible laminated structure; and encoding the at least onenon-transitory processor-readable medium with processor-readableinstructions which, when executed by the processor, configures theprocessor to perform operations comprising controlling the wirelesscommunications system to communicate wireless messages with one or morenetwork nodes.
 15. The method of claim 14, wherein, at each of multiplesegment locations, a respective sensor operable to generate ambient datacharacterizing an environmental state of the segment in response toexposure to external stimulus.
 16. The method of claim 15, furthercomprising, in each of multiple ones of the segments, electricallyconnecting an output of a respective sensor to an input of therespective wake circuit, and the respective wake circuit delivers powerfrom the energy source to the respective processor and the respectivewireless communications system in response to an output of the sensorthat exceeds a threshold level.
 17. The method of claim 16, wherein, ineach of multiple ones of the segments, the respective sensor is a strainsensor responsive to changes in strain in the respective segment. 18.The method of claim 16, wherein, in each of multiple ones of thesegments, the respective sensor is a capacitive sensor responsive tochanges in capacitance in the respective segment.
 19. The method ofclaim 16, wherein, in each of multiple ones of the segments, therespective sensor is a near-field communications sensor responsive tochanges in inductance in the respective segment.
 20. The method of claim14, further comprising producing visible demarcations of cut linesbetween adjacent sections of the adhesive product.